Statistics
Publications
2
Citations
75
H-Index
2
Active since
2014
Affiliations
National Tsing Hua University(Current)
Yan-Heng Chen is an author at National Tsing Hua University specializing in packaging design, package warpage, and fan-out wafer-level packaging.
Publications per year
2014–2025
2
2
Warpage characterization of panel Fan-out (P-FO) package
Hung‐wen Liu, Yiwei Liu, Jason Ji et al. · 2014 · 62 citations
Rou-Han Lai, Yi‐An Chen, Chung-Ying Chou et al. · Journal of Materials Chemistry A · 2025 · 13 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +17
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