Statistics
Publications
1
Citations
23
H-Index
1
Active since
2002
Affiliations
Digital Wave (United States)(Current)
T. Hongsmatip is an author at Digital Wave (United States) specializing in crack growth, packaging engineering, and crack growth analysis.
Publications per year
2002–2002
1
1
Fracture properties of molding compound materials for IC plastic packaging
J. Sauber, L. Lee, Shu‐Han Hsu et al. · 2002 · 23 citations
Natural Sciences, Materials Engineering, Materials Science +17
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