In-Bum Jeong

A low-cure-temperature copper nano ink for highly conductive printed electrodes

Byoung‐Yoon Lee, Yoonhyun Kim, Seungnam Yang et al. · Current Applied Physics · 2009 · 128 citations

Natural Sciences, Materials Engineering, Materials Science +12

Use of copper ink for fabricating conductive electrodes and RFID antenna tags by screen printing

Yoonhyun Kim, Byoung‐Yoon Lee, Seungnam Yang et al. · Current Applied Physics · 2011 · 121 citations

Arts, Electrical Engineering, Materials Science +17

Hybrid copper complex-derived conductive patterns printed on polyimide substrates

Byoung‐Yoon Lee, Sooncheol Jeong, Yoonhyun Kim et al. · Metals and Materials International · 2012 · 20 citations

Natural Sciences, Materials Engineering, Materials Science +13

Preparation of ultrathin polydimethylsiloxane-coating on Cu as oxidation-protection layer

Yoon‐Hyun Kim, Yoon‐Hyun Kim, Myung‐Geun Jeong et al. · Applied Surface Science · 2012 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +14

Improvement of the thermal flow with potting structured inductor for high power density in 40kW DC-DC converter

Bong-Gi You, Byoung‐Kuk Lee, Sangwon Lee et al. · 2012 · 10 citations

Engineering, Electrical Engineering, Mechanical Engineering +17